An Experimental Study on Cooling Performance of Microchannel Waterblock for Electronic Devices Cooling

전자기기 냉각용 마이크로채널 워터블록의 냉각성능에 관한 실험적 연구

The demand of high speed and miniaturization of electronic devices results in increased power dissipation requirement for thermal management. In this work, the effects of microchannel width, height and liquid flowrate on the cooling performances of microchannel waterblock are investigated experimentally. The microchannel waterblock considered ranged in width from 0.5 to 0.9 mm, with the channel height being nominally 1.7 to 9 times the width in each case. The experiments were conducted using water, over a liquid flow rate ranging from 0.2 to 2.0 lpm. The base temperature, thermal resistance and pressure drop increase with increasing of liquid flow rate. The measured thermal resistances ranged from 0.10 to 0.23 $^{\circ}C$/W for the channel 5.