한국정보디스플레이학회:학술대회논문집

The Korean Infomation Display Society (한국정보디스플레이학회)
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Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates;Principal Manufacturing Challenges and Solutions

  • O’Rourke, Shawn M. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Loy, Douglas E. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Moyer, Curt (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Ageno, Scott K. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • O’Brien, Barry P. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Bottesch, Dirk (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Marrs, Michael (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Dailey, Jeff (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Bawolek, Edward J. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Trujillo, Jovan (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Kaminski, Jann (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Allee, David R. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Venugopal, Sameer M. (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Cordova, Rita (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Colaneri, Nick (Flexible Display Center at Arizona State University, ASU Research Park) ;
  • Raupp, Gregory B. (Flexible Display Center at Arizona State University, ASU Research Park)
  • Published : 2007.08.27
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Abstract

Principal challenges to $\underline{direct\;fabrication}$ of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. Viable solutions to address these challenges are described.

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