Electrical Characteristics of Bottom-Contact Organic Thin-Film-Transistors Inserting Adhesion Layer Fabricated by Vapor Deposition Polymerization and Ti Adhesion Metal Layer

  • Park, Il-Houng (Dept. of Information Display, Hongik University, Center for Organic Materials and Information Devices) ;
  • Hyung, Gun-Woo (Center for Organic Materials and Information Devices, Dept. of Materials Science and Engineering, Hongik University) ;
  • Choi, Hak-Bum (Dept. of Information Display, Hongik University, Center for Organic Materials and Information Devices) ;
  • Kim, Young-Kwan (Dept. of Information Display, Hongik University, Center for Organic Materials and Information Devices)
  • Published : 2007.08.27

Abstract

The electrical characteristics of organic thin-filmtransistor (OTFTs) can be improved by inserting adhesion layer on gate dielectrics. Adhesion layer was used as polymeric adhesion layer deposited on inorganic gate insulators such as silicon dioxide $(SiO_2)$ and it was formed by vapor deposition polymerization (VDP) instead of spin-coating process. The OTFTs obtained the on/off ratio $of{\sim}10^4$, threshold voltage of 1.8V, subthreshold slop of 2.9 V/decade and field effect mobility about $0.01\;cm^2/Vs$.

Keywords