다중 PCB 적층 모듈구조의 정보통신용 캐비넷 강제대류 냉각특성 연구

Forced Convective Cooling Characteristics with Stacked Modules of Multi-PCBs' in Telecommunication Cabinet

A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.