Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Fabrication of Solder Bump Pattern Using Thin Mold

박판 몰드를 이용한 솔더 범프 패턴의 형성 공정

  • 남동진 (한국과학기술원 기계공학과) ;
  • 이재학 (한국과학기술원 기계공학과) ;
  • 유중돈 (한국과학기술원 기계공학과)
  • Published : 2007.04.30
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Abstract

Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

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References

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