Journal of the Korean Society for Nondestructive Testing (비파괴검사학회지)

The Korean Society for Nondestructive Testing (한국비파괴검사학회)
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Nondestructive Evaluation of Nanostructured Thin Film System Using Scanning Acoustic Microscopy

초음파현미경을 이용한 나노 구조 박막 시스템의 비파괴평가

  • ;
  • 박익근 (서울과학기술대학교 기계공학과) ;
  • 박태성 (서울과학기술대학교 기계공학과)
  • Received : 2010.08.05
  • Accepted : 2010.10.08
  • Published : 2010.10.30
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Abstract

In recent years, as nano scale structured thin film technology has emerged in various fields such as the materials, biomedical and acoustic sciences, the quantitative nondestructive adhesion evaluation of thin film interfaces using ultra high frequency scanning acoustic microscopy(SAM) has become an important issue in terms of the longevity and durability of thin film devices. In this study, an effective technique for investigating the interfaces of nano scale structured thin film systems is described, based on the focusing of ultrasonic waves, the generation of leaky surface acoustic waves(LSAWs), V(z) curve simulation and ultra high frequency acoustical imaging_ Computer simulations of the V(z) curve were performed to estimate the sensitivity of detection of micro flaws(i.e., delamination) in a thin film system. Finally, experiments were conducted to confirm that a SAM system operating at a frequency of 1 GHz can be useful to visualize the micro flaws in nano structured thin film systems.

최근 재료, 생물의학(biomedicine), 음향, 전자 등 다양한 분야에서 나노 구조를 갖는 박막 기술이 도입되면서 박막 계면의 수명과 내구성 확보를 위한 초고주파수의 초음파현미경을 이용한 정량적인 비파괴적 접합평가에 관한 연구가 큰 이슈가 되고 있다. 본 연구에서는 초음파의 집속, 누설탄성표면파의 발생과 V(z) 곡선의 시뮬레이션 그리고 초고주파수 음향 이미징 기법을 이용하여 나노 스케일 구조를 갖는 박막 시험편의 접합계면을 평가하였다. V(z) 곡선의 컴퓨터 시뮬레이션을 통하여 접합계면에 존재하는 미세 결함(디라미네이션 등)의 검출 감도를 추정할 수 있었으며, 1 GHz의 초고주파수 디포커싱 모드로 박막 시험편의 접합계면에 존재하는 나노 스케일의 미세 결함을 음향 이미지로 가시화 할 수 있어 나노 구조를 갖는 박막의 접합계면의 비파괴평가에 초음파현미경이 매우 유용함을 알 수 있었다.

Keywords

Acknowledgement

Supported by : 한국연구재단

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