Journal of the Korean Society for Nondestructive Testing (비파괴검사학회지)

The Korean Society for Nondestructive Testing (한국비파괴검사학회)
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Evaluation of Microscopic Degradation of Copper and Copper Alloy by Electrical Resistivity Measurement

전기비저항 측정에 의한 구리와 구리합금의 미시적 열화평가

  • Received : 2010.08.07
  • Accepted : 2010.10.08
  • Published : 2010.10.30
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Abstract

In the present study, the microscopic degradation of copper and copper alloy subjected to cyclic deformation has been evaluated by the electrical resistivity measurement using the DC four terminal potential method. The copper (Cu) and copper alloy (Cu-35Zn), whose stacking fault energy is much different each other, were cyclically deformed to investigate the response of the electrical resistivity to different dislocation substructures. Dislocation cell substructure was developed in the Cu, while the planar array of dislocation structure was developed in the Cu-35Zn alloy increasing dislocation density with fatigue cycles. The electrical resistivity increased rapidly in the initial stage of fatigue deformation in both materials. Moreover, after the fatigue test it increased by about 7 % for the Cu and 6.5 % for the Cu-35Zn alloy, respectively. From these consistent results, it may be concluded that the dislocation cell structure responds to the electrical resistivity more sensitively than the planar array dislocation structure evolved during cyclic fatigue.

본 연구에서는 전류 4단자 전위차법을 이용한 전기비저항을 측정하여 반복피로손상을 받은 구리와 구리합금의 미시적 열화를 평가하였다. 서로 매우 다른 적층결함 에너지를 갖는 구리(Cu)와 구리합금(Cu-35Zn)에 대해 반복피로손상을 가하고 이들 재료에서 발달한 전위구조와 전기비저항 간의 관계를 연구하고자 하였다. Cu는 전위셀 하부구조를 형성하였지만, Cu-35Zn 합금은 피로사이클에 따라서 전위밀도는 증가하고 평면배열의 전위구조를 형성하였다. 전기비저항은 두 재료 모두에서 피로변형 초기 단계에서 급격하게 증가하였다. 더욱이, 피로시험 후 구리는 약 7 % 그리고 구리 합금은 약 6.5 % 변하였다. 이러한 일관적인 결과들로부터, 반복적인 피로에 의해 발달한 전위 셀구조는 평면배열의 전위구조보다도 전기비저항에 매우 민감한 것으로 판단된다.

Keywords

References

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