한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제28권2호
  • /
  • Pages.193-201
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  • 2011
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  • 1225-9071(pISSN)
  • /
  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

패키지 기판 습식 공정용 클램프 이송 장치의 개발

Development of Clamp Type Transferring Mechanism for Package Substrate's Wet Process

  • 유선중 (삼성전기 설비개발그룹) ;
  • 허준연 (삼성전기 설비개발그룹) ;
  • 조승현 (동양미래대학 기계공학부)
  • Ryu, Sun-Joong (Equipment Development Group, Samsung Electro-Mechanics Co. LTD.) ;
  • Heo, Jun-Yeon (Equipment Development Group, Samsung Electro-Mechanics Co. LTD.) ;
  • Cho, Seung-Hyun (Dept. of Mechanical Engineering, Dongyang Mirae University)
  • 투고 : 2010.07.12
  • 심사 : 2010.11.19
  • 발행 : 2011.02.01
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초록

Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.

키워드

참고문헌

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