Journal of the Korean Society of Visualization (한국가시화정보학회지)

The Korean Society of Visualization (한국가시화정보학회)
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Analysis of temperature distribution of wafers inside LPCVD chamber for improvement of thickness uniformity

두께 균일도 향상을 위한 LPCVD 챔버 내 웨이퍼 온도 분포 분석

  • Kang, Seung-Hwan (Graduate School, Department of Mechanical Engineering, Sungkyunkwan University) ;
  • Kim, Byeong Hoon (Samsung Electronics, Memory Business) ;
  • Kong, Byung Hwan (Samsung Electronics, Memory Business) ;
  • Lee, Jae Won (Graduate School, Department of Mechanical Engineering, Sungkyunkwan University) ;
  • Ko, Han Seo (School of Mechanical Engineering, Sungkyunkwan University)
  • Received : 2016.07.25
  • Accepted : 2016.08.17
  • Published : 2016.08.31
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Abstract

The wafer temperature and its uniformity inside the LPCVD chamber were analyzed. The temperature uniformity at the end of the wafer load depends on the heat-insulating cap. The finite difference method was used to investigate the radiation and conduction heat transfer mechanisms, and the temperature field and heat diffusion in the LPCVD chamber was visualized. It was found that the temperature uniformity of the wafers could be controlled by the size and distance of the heat-insulating cap.

Keywords

References

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