Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Stretchable Deformation-Resistance Characteristics of Metal Thin Films for Stretchable Interconnect Applications I. Effects of a Parylene F Intermediate Layer and PDMS Substrate Swelling

신축 전자패키지 배선용 금속박막의 신축변형-저항 특성 I. Parylene F 중간층 및 PDMS 기판의 Swelling에 의한 영향

  • Park, Donghyun (Department of Materials Science and Engineering, Hongik University) ;
  • Oh, Tae Sung (Department of Materials Science and Engineering, Hongik University)
  • 박동현 (홍익대학교 공과대학 신소재공학과) ;
  • 오태성 (홍익대학교 공과대학 신소재공학과)
  • Received : 2017.09.12
  • Accepted : 2017.09.25
  • Published : 2017.09.30
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Abstract

We investigated the feasibility of parylene F usage as an intermediate layer between a polydimethylsiloxane (PDMS) substrate and an Au thin-film interconnect as well as the swelling effect of PDMS substrate on the stretchable deformability of an Au thin film. The 150-nm-thick Au film, which was sputtered on a PDMS substrate without a parylene F layer, exhibited an initial resistance of $11.7{\Omega}$ and an overflow of its resistance at a tensile strain of 12.5%. On the other hand, the Au film, which was formed with a 150-nm-thick parylene F layer, revealed an much improved resistance characteristics: $1.21{\Omega}$ as its initial resistance and $246{\Omega}$ at its 30% elongation state. With swelling of PDMS substrate, the resistance of an Au film substantially decreased to $14.4{\Omega}$ at 30% tensile strain.

Polydimethylsiloxane (PDMS) 신축기판과 Au 박막 사이의 중간층으로서 parylene F의 적용 가능성을 분석하고, Au 박막의 스퍼터링 중에 발생하는 PDMS 기판의 swelling이 Au 박막의 신축변형-저항 특성에 미치는 영향을 분석하였다. Parylene F 중간층 없이 PDMS 기판에 스퍼터링한 150 nm 두께의 Au 박막은 $11.7{\Omega}$의 초기저항을 나타내었으며, 12.5%의 인장변형률에서 저항의 overflow가 발생하였다. 반면에 150 nm 두께의 parylene F 중간층을 갖는 Au 박막의 초기저항은 $1.21{\Omega}$이었으며 30% 인장변형률에서 저항이 $246{\Omega}$으로 저항증가비가 현저히 낮아졌다. PDMS 기판의 swelling이 발생함에 따라 30% 인장변형률에서 Au 박막의 저항이 $14.4{\Omega}$으로 크게 저하되었다.

Keywords

References

  1. D. Park, S. J. Shin and T. S. Oh, "Stretchable Characteristics of Thin Au Films on Polydimethylsiloxane Substrates with the Parylene Intermediate Layer for Stretchable Electronic Packaging", J. Electron. Mater., 1 (2017)
  2. D. Park and T. S. Oh, "Comparison of Flip-chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-chip Bonding on Rigid Substrates", Mater. Trans., 58(8), 1212 (2017). https://doi.org/10.2320/matertrans.M2017065
  3. D. Park, K. S. Han and T. S. Oh, "Comparison of Flip-chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-chip Bonding on Compliant Substrates", Mater. Trans. 58(8), 1217 (2017). https://doi.org/10.2320/matertrans.M2017066
  4. J. H. Ahn and J. H. Je, "Stretchable Electronics: Materials, Architectures and Integrations", J. Phys. D: Appl. Phys., 45, 102001 (2012).
  5. D. H. Kim and J. A. Rogers, "Stretchable Electronics: Materials Strategies and Devices", Adv. Mater., 20, 4887 (2008). https://doi.org/10.1002/adma.200801788
  6. S. Yao and Y. Zhu, "Nanomaterial-enabled Stretchable Conductors: Strategies, Materials and Devices", Adv. Mater., 27, 1480 (2015). https://doi.org/10.1002/adma.201404446
  7. Y. Wang, Z. Li and J. Xiao, "Stretchable Thin Film Materials: Fabrication, Application, and Mechanics", J. Electron. Packag., 138, 020801 (2016). https://doi.org/10.1115/1.4032984
  8. S. Wagner, S. P. Lacour, J. Jones, I. H. Pai-hui, J. C. Sturm, T. Li and Z. Suo, "Electronic Skin: Architecture and Components", Physica E: Low-dimensional Systems and Nanostructures, 25(2), 326 (2004). https://doi.org/10.1016/j.physe.2004.06.032
  9. J. Y. Choi and T. S. Oh, "Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications", Mater. Trans., 56, 1711 (2015). https://doi.org/10.2320/matertrans.M2015106
  10. J. Y. Choi and T. S. Oh, "Contact Resistance of Flip-Chip Joints in Wearable Electronic Textiles", J. Electron. Mater., 43, 4464 (2014). https://doi.org/10.1007/s11664-014-3431-8
  11. A. P. Robinson, I. Minev, I. M. Graz and S. P. Lacour, "Microstructured Silicone Substrate for Printable and Stretchable Metallic Films", Langmuir 27, 4279 (2011). https://doi.org/10.1021/la103213n
  12. O. Akogwu, D. Kwabi, S. Midturi, M. Eleruja, B. Babatope and W. O. Soboyejo, "Large Strain Deformation and Cracking of Nano-scale Gold Films on PDMS Substrate", Mater. Sci. Eng. B., 170, 32 (2010). https://doi.org/10.1016/j.mseb.2010.02.023
  13. I. M. Graz, D. P. J. Cotton and S. P. Lacour, "Extended Cyclic Uniaxial Loading of Stretchable Gold Thin-films on Elastomeric Substrates", Appl. Phys. Lett., 94, 071902 (2009). https://doi.org/10.1063/1.3076103
  14. F. Xu and Y. Zhu, "Highly Conductive and Stretchable Silver Nanowire Conductors", Adv. Mater., 24, 5117 (2012). https://doi.org/10.1002/adma.201201886
  15. T. Sekitani, Y. Noguchi, K. Hata, T. Fukushima, T. Aida and T. Someya, "A Rubberlike Stretchable Active Matrix using Elastic Conductors", Science, 321, 1468 (2008). https://doi.org/10.1126/science.1160309
  16. K. Y. Chun, Y. Oh, J. Rho, J. H. Ahn, Y. J. Kim, H. R. Choi and S. Baik, "Highly Conductive, Printable and Stretchable Composite Films of Carbon Nanotubes and Silver", Nature Nanotechnol, 5, 853 (2010). https://doi.org/10.1038/nnano.2010.232
  17. Y. Y. Hsu, C. Papakyrikos, D. Liu, X. Wang, M. Raj, B. Zhang and R. Ghaffari, "Design for Reliability of Multi-layer Stretchable Interconnects", J. Micromech. Microeng., 24, 095014 (2014). https://doi.org/10.1088/0960-1317/24/9/095014
  18. Y. Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren and I. D. Wolf, "Polyimide-enhanced Stretchable Interconnects: Design, Fabrication, and Characterization", Thin Solid Films, 519, 2225 (2011). https://doi.org/10.1016/j.tsf.2010.10.069
  19. A. C. M. Kuo, "Poly (dimethylsiloxane)", Polymer Data Handbook, pp.411-435 (1999).
  20. Dow Corning, "Sylgard 184 Silicone Elastomer", http://www.dowcorning.com/DataFiles/090276fe80190b08.pdf.
  21. J. Y. Choi, D. W. Park and T. S. Oh, "Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications", J. Microelectron. Packag. Soc., 21(4), 125 (2014). https://doi.org/10.6117/kmeps.2014.21.4.125
  22. H. A. Oh, D. Park, K. S. Han and T. S. Oh, "Elastic Modulus of Locally Stiffness-variant Polydimethylsiloxane Substrates for Stretchable Electronic Packaging Applications", J. Microelectron. Packag. Soc., 22(4), 91 (2015). https://doi.org/10.6117/kmeps.2015.22.4.091
  23. H. A. Oh, D. Park, S. J. Shin and T. S. Oh, "Deformation Behavior of Locally Stiffness-variant Stretchable Substrates Consisting of the Island Structure", J. Microelectron. Packag. Soc., 22(4), 117 (2015). https://doi.org/10.6117/kmeps.2015.22.4.117
  24. A. Befahy, P. Lipnik, T. Pardoen, C. Nascimento, B. Patris, P. Bertrand and S. Yunus, "Thickness and Elastic Modulus of Plasma Treated PDMS Silica-like Surface Layer", Langmuir, 26, 3372 (2010). https://doi.org/10.1021/la903154y
  25. I. D. Johnston, D. K. McCluskey, C. K. L. Tan and M. C. Tracey, "Mechanical Characterization of Bulk Sylgard 184 for Microfluidics and Microengineering", J. Micromech. Microeng., 24, 035017 (2014). https://doi.org/10.1088/0960-1317/24/3/035017
  26. K. S. Hwang, J. H. Park, J. H. Lee, D. S. Yoon and T. S. Kim, "Effect of Atmospheric-plasma Treatments for Enhancing Adhesion of Au on Parylene-c-coated Protein Chips", J. Korean Phys. Soc., 44, 1168 (2004).
  27. M. J. Cordill, A. Taylor, J. Schalko and G. Dehm, "Fracture and Delamination of Chromium Thin Films on Polymer Substrates", Metall. Mater. Trans., 41A, 870 (2010).
  28. S. Bhattacharya, A. Datta, J. M. Berg and S. Gangopadhyay, "Studies on Surface Wettability of Poly (dimethyl) Siloxane (PDMS) and Glass under Oxygen-plasma Treatment and Correlation with Bond Strength", J. Microelectromech. Syst., 14(3), 590 (2005). https://doi.org/10.1109/JMEMS.2005.844746
  29. S. P. Lacour, J. Jones, S. Wagner, T. Li and Z. Suo, "Stretchable Interconnects for Elastic Electronic Surfaces", Proc. IEEE, 93(8), 1459 (2005). https://doi.org/10.1109/JPROC.2005.851502
  30. N. Chou, J. Jeong and S. Kim, "Crack-free and Reliable Lithographical Patterning Methods on PDMS Substrate", J. Micromech. Microeng., 23, 125035 (2013). https://doi.org/10.1088/0960-1317/23/12/125035
  31. C. Hassler, T. Boretius and T. Stieglitz, "Polymers for Neural Implants", J. Polymer Sci. B: Polymer Phys., 49(1), 18 (2011). https://doi.org/10.1002/polb.22169
  32. A. Khabari, and F. K. Urban. "Partially Ionized Beam Deposition of Parylene", J. Non-Cryst. Solids., 351(43), 3536 (2005) https://doi.org/10.1016/j.jnoncrysol.2005.08.027
  33. N. Chou, S. Yoo and S. Kim, "A Largely Deformable Surface Type Neural Electrode Array Based on PDMS", IEEE Trans. Neural Syst. Rehabil. Eng., 21, 544 (2013). https://doi.org/10.1109/TNSRE.2012.2210560
  34. N. Majid, S. Dabral and J. F. McDonald, "The Parylene-aluminum Multilayer Interconnection System for Wafer Scale Integration and Wafer Scale Hybrid Packaging", J. Electron. Mater., 18(2), 301 (1989) https://doi.org/10.1007/BF02657422
  35. S. P. Lacour, S. Wagner, Z. Huang and Z. Suo, "Stretchable Gold Conductors on Elastomeric Substrates", Appl. Phys. Lett., 82, 2404 (2003). https://doi.org/10.1063/1.1565683
  36. D. Y. Khang, J. A. Rogers and H. H. Lee, "Mechanical Buckling: Mechanics, Metrology, and Stretchable Electronics", Adv. Funct. Mater., 19(10), 1526 (2009). https://doi.org/10.1002/adfm.200801065
  37. J. Jones, S. P. Lacour, S. Wagner and Z. Suo, "Stretchable Wavy Metal Interconnects", J. Vacuum Sci. Technol., A 22(4), 1723 (2004).
  38. Y. Chen, W. Pei, R. Tang, S. Chen and H. Chen, "Conformal Coating of Parylene for Surface Anti-adhesion in Polydimethylsiloxane (PDMS) Double Casting Technique", Sens. Actuators., A 189, 143 (2013).
  39. X. P. Bi, N. L. Ward, B. P. Crum and W. Li, "Plasma-treated Switchable Wettability of Parylene-C Surface", Proc. 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Koyto, IEEE, 222 (2012).
  40. T. Tatiana, T. Prodromakis and C. Toumazou, "Oxygen Plasma Induced Hydrophilicity of Parylene-C Thin Films", Appl. Surf. Sci., 261, 43 (2012). https://doi.org/10.1016/j.apsusc.2012.06.112
  41. V. Santucci, F. Maury and F. Senocq, "Vapor Phase Surface Functionalization under Ultra Violet Activation of Parylene Thin Films Grown by Chemical Vapor Deposition", Thin Solid Films, 518(6), 1675 (2010). https://doi.org/10.1016/j.tsf.2009.11.064
  42. K. G. Pruden, K. Sinclair and S. Beaudoin, "Characterization of Parylene-N and Parylene-C Photooxidation", J. Polymer Sci., A 41(10), 1486 (2003).
  43. L. Yang, N. Shirahata, G. Saini, F. Zhang, L. Pei, M. C. Asplund, D. G. Kurth, K. Ariga, K. Sautter, T. Nakanishi, V. Smentkowski and M. R. Linford, "Effect of Surface Free Energy on PDMS Transfer in Microcontact Printing and Its Application to ToF-SIMS to Probe Surface Energies", Langmuir, 25, 5674 (2009). https://doi.org/10.1021/la804272n
  44. M. Golda, M. Brzychczy-Wloch, M. Faryna, K. Engvall and A. Kotarba, "Oxygen Plasma Functionalization of Parylene C Coating for Implants Surface: Nanotopography and Active Sites for Drug Anchoring", Mater. Sci. Eng. C., 33(7), 4221 (2013). https://doi.org/10.1016/j.msec.2013.06.014
  45. S. P. Lacour, J. Jones, Z. Suo and S. Wagner, "Design and Performance of Thin Metal Film Interconnects for Skin-like Electronic Circuits", IEEE Electron Device Lett., 25(4), 179 (2004). https://doi.org/10.1109/LED.2004.825190