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Comparative investigation of endurance and bias temperature instability characteristics in metal-Al2O3-nitride-oxide-semiconductor (MANOS) and semiconductor-oxide-nitride-oxide-semiconductor (SONOS) charge trap flash memory

  • Kim, Dae Hwan (School of Electrical Engineering , Kookmin University) ;
  • Park, Sungwook (School of Electrical Engineering , Kookmin University) ;
  • Seo, Yujeong (Department of Electronics Engineering, Korea University) ;
  • Kim, Tae Geun (Department of Electronics Engineering, Korea University) ;
  • Kim, Dong Myong (School of Electrical Engineering , Kookmin University) ;
  • Cho, Il Hwan (Department of Electronic Engineering , Myongji University)
  • Received : 2012.03.23
  • Published : 2012.12.31

Abstract

The program/erase (P/E) cyclic endurances including bias temperature instability (BTI) behaviors of Metal-$Al_2O_3$-Nitride-Oxide-Semiconductor (MANOS) memories are investigated in comparison with those of Semiconductor-Oxide-Nitride-Oxide-Semiconductor (SONOS) memories. In terms of BTI behaviors, the SONOS power-law exponent n is ~0.3 independent of the P/E cycle and the temperature in the case of programmed cell, and 0.36~0.66 sensitive to the temperature in case of erased cell. Physical mechanisms are observed with thermally activated $h^*$ diffusion-induced Si/$SiO_2$ interface trap ($N_{IT}$) curing and Poole-Frenkel emission of holes trapped in border trap in the bottom oxide ($N_{OT}$). In terms of the BTI behavior in MANOS memory cells, the power-law exponent is n=0.4~0.9 in the programmed cell and n=0.65~1.2 in the erased cell, which means that the power law is strong function of the number of P/E cycles, not of the temperature. Related mechanism is can be explained by the competition between the cycle-induced degradation of P/E efficiency and the temperature-controlled $h^*$ diffusion followed by $N_{IT}$ passivation.

Keywords

References

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