Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Quartz Megasonic System for Cleaning Flat Panel Display

평판디스플레이 세정 용 Quartz 메가소닉 시스템

  • Kim, Hyunse (Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials) ;
  • Lee, Yanglae (Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials) ;
  • Lim, Euisu (Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials)
  • 김현세 (한국기계연구원 극한기계연구본부) ;
  • 이양래 (한국기계연구원 극한기계연구본부) ;
  • 임의수 (한국기계연구원 극한기계연구본부)
  • Received : 2014.10.20
  • Accepted : 2014.11.12
  • Published : 2014.12.01
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Abstract

In this article, the megasonic cleaning system for cleaning micro/nano particles from flat panel display (FPD) surfaces was developed. A piezoelectric actuator and a waveguide were designed by finite element method (FEM) analysis. The calculated peak frequency value of the quartz waveguide was 1002 kHz, which agreed well with the measured value of 1003 kHz. The average acoustic pressure of the megasonic cleaning system was 43.1 kPa, which is three times greater than that of the conventional type of 13.9 kPa. Particle removal efficiency (PRE) tests were performed, and the cleaning efficiency of the developed system was proven to be 99%. The power consumption of the developed system was 64% lower than that of the commercial system. These results show that the developed megasonic cleaning system can be an effective solution in particle removing from FPD substrate with higher energy efficiency and lower chemical and ultra pure water (UPW) consumption.

Keywords

References

  1. Lee, J., Liu, D. N., and Wu, S.-T., "Introduction to Flat Panel Displays," Wiley, 2008.
  2. Geng, H., "Semiconductor Manufacturing Handbook," McGraw-Hill, 2005.
  3. Park, I. S., Choi, S. J., Hong, C. K., Cho, H.-K., Lu, Y. Q., et al., "Meeting the Critical Challenges for 65 nm and Beyond using a Single Wafer Processing with Novel Megasonics and Drying Technologies," ECS Trans., Vol. 1, No. 3, pp. 172-179, 2005.
  4. Kanegsberg, B., "Critical Cleaning," CRC Press, 2001.
  5. Lee, Y., Lim, E., Kang, K., Kim, H., Kim, T.-G., et al., "Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal," Proc. of the 8th Int. Symp. Ultra Clean Processing Semiconductor Surfaces, pp. 65-66, 2006.
  6. Moumen, N., Guarrera, M., Piboontum, C., and Busnaina, A. A., "Contact and Non Contact post- CMP Cleaning of Thermal Oxide Silicon Wafers," Proc. of IEEE/SEMI Advanced Semiconductor Manuf. Conf., pp. 250-253, 1999.
  7. Deymier, P. A., Khelif, A., Djafari-Rouhani, B., Vasseur, J. O., and Raghavan, S., "Theoretical Calculation of the Acoustic Force on a Patterned Silicon Wafer during Megasonic Cleaning," J. Appl. Phys., Vol. 88, No. 5, pp. 2423-2429, 2000.
  8. Busnaina, A. A. and Lin, H., "Physical Removal of Nano-Scale Defects from Surfaces," Proc. of IEEE/SEMI Advanced Semiconductor Manuf. Conf., pp. 272-277, 2002.
  9. Lin, H., Busnaina, A. A., and Suni, I. I., "Cleaning of high aspect ratio submicron trenches," Proc. of IEEE/SEMI Advanced Semiconductor Manuf. Conf., pp. 304-308, 2002.
  10. Yin, X. and Komvopoulos, K., "Dynamic Finite Element Analysis of Failure in Alternating Phase- Shift Masks Caused by Megasonic Cleaning," IEEE Trans. Components Packaging Tech., Vol. 33, No. 1, pp. 46-55, 2005.
  11. Lauerhaas, J., Mertens, P. W., Fyen, W., Kenis, K., Meuris, M., et al., "Single Wafer Cleaning and Drying: Particle Removal via a Non-Contact, Non-Damaging Megasonic Clean Followed by a High Performance "Rotagoni" dry," Proc. of 9th Int'l Symposium on Semicon. Manuf., pp. 157-160, 2000.
  12. Liu, L., Walter, A., and Novak, R., "Single-wafer Tool Performs Re-Contamination Free in Wet Wafer Cleaning," ECS Trans., Vol. 1, No. 3, pp. 150-157, 2005.
  13. Lippert, A., Engesser, P., Gleissner, A., Koffler, M., Kumnig, F., et al., "Keys to Advanced Single Wafer Cleaning - Gas Contend, Bubble Size Distribution and Chemistry," ECS Trans., Vol. 1, No. 3, pp. 158-163, 2005.
  14. Kim, H., Lee, Y., and Lim, E., "Design and Fabrication of an L-type Waveguide Megasonic System for Cleaning of Nano-Scale Patterns," Current Applied Physics, Vol. 9, pp. e189-e192, 2009. https://doi.org/10.1016/j.cap.2008.12.058
  15. Kim, H., Lee, Y., and Lim, E., "A Quartz-bar Megasonic System for Nano-Pattern Cleaning," Int. J. Precis. Eng. Manuf., Vol. 14, No. 10, pp. 1713-1718, 2013. https://doi.org/10.1007/s12541-013-0230-8
  16. Mitsumori, K., Nobuaki, H., Takahashi, N., Imaoka, T., and Ohmi, T., "Advanced Wet Cleaning using Novel Nozzle and Functional Ultrapure Water in Next Generation FPD/LSI Manufacturing," Proc. of 9th Int. Symposium on Semicon. Manuf., pp. 329-332, 2000.
  17. McQueen, D. H., "Frequency Dependence of Ultrasonic Cleaning," Ultrasonics, Vol. 24, No. 5, pp. 273-280, 1986. https://doi.org/10.1016/0041-624X(86)90105-8
  18. Quan, Q. and Brereton, G. J., "Mechanisms of Removal of Micron-Sized Particles by High- Frequency Ultrasonic Waves," IEEE Trans. Ultrason. Ferroelectr. Freq. Control, Vol. 42, No. 4, pp. 619-629, 1995. https://doi.org/10.1109/58.393105
  19. Hauptmann, M., Brems, S., Camerotto, E., Zijlstra, A., Doumen, G., et al., "Influence of Gasification on the Performance of a 1 MHz Nozzle System in Megasonic Cleaning," Microelectronic Engineering Vol. 87, No. 5-8, pp. 1512-1515, 2010. https://doi.org/10.1016/j.mee.2009.11.061
  20. Habuka, H., Fukumoto, R., Okada, Y., and Kato, M., "Dominant Forces for Driving Bubbles in a Wet Cleaning Bath using Megasonic Wave," J. Electrochemical Society, Vol. 157, No. 6, pp. H585- H588, 2010. https://doi.org/10.1149/1.3365114
  21. Hauptmann, M., Struyf, H., Mertens, P., Heyns, M., De Gendt, S., et al., "Towards an Understanding and Control of Cavitation Activity in 1 MHz Ultrasound Fields," Ultrasonics Sonochemistry, Vol. 20, No. 1, pp. 77-88, 2013. https://doi.org/10.1016/j.ultsonch.2012.05.004
  22. Keswani, M., Raghavan, S., and Deymier, P., "Characterization of Transient Cavitation in Gas Sparged Solutions Exposed to Megasonic Field using Cyclic Voltammetry," Microelectronic Engineering Vol. 102, pp. 91-97, 2013. https://doi.org/10.1016/j.mee.2011.11.013